Description
The Shimadzu MIV-X (MAIVIS) ultrasonic optical flaw detector is a non-destructive testing system for locating cracks, voids, coating delamination, and joint defects, primarily at or near material surfaces. It is designed for inspecting metals, ceramics, composites, and multi-material structures, including adhesive and multilayer joints.
The system uses ultrasonic optical flaw detection: an ultrasonic oscillator excites the specimen, while laser illumination and a camera capture microscopic surface displacements. By combining speckle shearing interferometry with stroboscopic imaging, the software visualizes ultrasonic wave propagation. Disturbances in the wavefield help locate potential flaws without destroying the inspected component.
Unlike conventional sequential scanning with an ultrasonic probe, the MIV-X allows inspection of the wavefield across the camera’s field of view. Depending on camera distance, the inspection area ranges from approximately 100 × 150 to 400 × 600 mm. Under suitable conditions, the minimum detectable flaw size is approximately 1 mm, or approximately 0.5 mm with the optional optical zoom set. Actual detection performance depends on material properties, geometry, and inspection conditions.
Features
- Ultrasonic excitation from 20 to 400 kHz with optical visualization of the wavefield.
- Inspection of a wide surface area in a single observation sequence.
- Software noise removal, background-wave filtering, flaw marking, and dimension measurements.
- Automatic inspection-condition search, frequency scanning, and result storage.
- Optional camera stand and optical zoom set for different inspection configurations.
Applications
- Detecting cracks below films and coatings and local surface discontinuities.
- Inspection of paint, protective, and thermal-spray coating delamination.
- Investigation of adhesive joints between composites and metals, as well as dissimilar-material joints.
- Non-destructive inspection in materials science, mechanical engineering, transport, and electronics manufacturing.
The method is primarily intended for surface and near-surface flaws and complements conventional ultrasonic testing. The computer, couplant, power cable, and camera stand are not included in the manufacturer’s base universal set.